OMAP35x and AM/DM37x Wireless Connectivity Product description

The following describes the content of the wireless connectivity package for OMAP35x & AM/DM37x platforms, its various features and its solution capabilities.

General Description

The comprehensive wireless connectivity package enables you to add wireless connectivity support to the OMAP35x & AM/DM37x EVM features. As part of the EVM kit, it immediately enables you to add wireless connectivity capabilities to the Applications Processor. This solution includes an integrated system solution for both WLAN and Bluetooth® (BT) based on TI's wireless devices.

The package encapsulates both the HW component in the form of an add-on board for the OMAP35x or AM/DM37x EVM, as well as a complete SW package which includes the WLAN driver and Bluetooth initialization scripts. Both were fully integrated and tested with this specific platform, thus minimizing integration time.

Solution Block Diagram

The wireless connectivity solution is based on a WiLink™ 6 chipset solution populated on a module. WiLink™ 6 is TI's 6th generation of wireless connectivity devices, encompassing a combo Bluetooth-WLAN device in 65nm technology. This device is accompanied by a DC2DC converter and a Front-End module (designated FEM).

Wireless Connectivity Module by LSR

The LSR module provides the complete wireless connectivity chipset described above including clocks and powering scheme. It may be procured directly from LSR and placed on any OMAP35x, AM/DM37x-based user application board. For further information regarding the module specification, go to Hardware Specification page.

DC2DC Converter

The DC2DC converter, is a high-efficiency low-noise, switched mode power supply converter (SMPS). It converts VBAT levels in the 2.7 - 5.5 V range to 1.8V, which is required by the device.

Front-End Module

The Front-End Module (FEM) device carries a powerful PA which is used to provide WLAN output power gain. Additionally, a 3-way switch is located in the FEM device to enable antenna sharing among WLAN and Bluetooth, thus providing a single antenna solution supporting both WLAN and Bluetooth.

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  LSR Module

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  OMAP35xx EVM

Product Features and Capabilities

General

Supported OS

Linux ver. 2.6.x

WinCE 6.0 R3

Supplies

VBAT - 3.0 - 5.5V battery supply

VIO - 1.8V I/O supply

Clocks

Reference clock - 38.4 MHz

Sleep clock - 32.768 KHz

Host I/Fs

SDIO, 4-bit, 25 MHz for WLAN

UART, with flow control for Bluetooth

WLAN

• WLAN station
• 802.11 b,g,n,d,e,i compliant
• 802.11n single antenna

• 20MHz, 1 spatial stream support
• RX STBC support

• Security

• Personal security protocols and services covering: WEP, WPA & WPA2
• Open-source supplicant

• QOS

• EDCA capability including packet bursting and TXOP
• U-APSD capability

• Scan

• Active scan
• Passive scan

• Roaming

• Low RSSI roaming trigger
• BSS loss roaming trigger

• WPS (Linux only)

• WPS enrollee, PIN mode
• WPS enrollee, PBC mode

Bluetooth

• Bluetooth 2.1 + EDR compliant
• Linux: Integrated to BlueZ protocol stack
• Validated Linux Profiles: A2DP, OPP, FTP
• WinCE: Integrated with Microsoft's protocol stack and Adeneo's Bluetooth Manager
• Validated WinCE Profiles: A2DP, OPP, FTP

Misc

• Bluetooth-WLAN coexistence:

• Best-in-class single antenna coexistence scheme enabling a full proof shared antenna solution
• All data & voice use cases combinations are supported

• Proprietary low power schemes:

Provides extremely low power consumption in critical profiles (such as: WLAN idle connection and Bluetooth scan)

See Also

• Module HW Specifications
• SW Specifications

Links

• TI OMAP Processors
• Wireless Connectivity on ti.com
• WiLink6 on TI.com

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