Memory Vendor Selection Guide

Sitara Memory Package options

For the Sitara product line there are several different options for memory packages.  We currently support PoP memory packages on the OMAP35x and the AM/DM37x devices.  These 2 devices also have a non-PoP discrete memory option.  All other devices support discrete memories only.  Below is a list of the current memory options:

• AM17x - Discrete only
• AM18x - Discrete only
• OMAP35x - PoP and Discrete 
  • CBB package - 168 ball 12x12 PoP memories
    • DRAM - PoP or discrete. All SDRC signals are on both top and bottom balls
    • Flash - PoP or discrete - All GPMC signals are on both top and bottom balls
  • CBC packag - 152 ball 14x14 PoP memories
    • DRAM - PoP only. SDRC signals occur only on top balls
    • Flash - PoP or discrete - top balls do not have A[10:1] (PoP only supports mux mode) 
  • CUS package - Discrete Only
• AM35x - Discrete only
• AM/DM37x - PoP and Discrete
  • CBP package - 168 ball 12x12 PoP memories
    • DRAM - PoP only. SDRC signals occur only on top balls
    • Flash - PoP or discrete - All GPMC signals are on both top and bottom balls
  • CBC package - 152 ball 14x14 PoP memories
    • DRAM - PoP only. SDRC signals occur only on top balls
    • Flash - PoP or discrete - top balls do not have A[11:1] (PoP only supports mux mode)
  • CUS package - Discrete Only
• AM335x - Discrete only
  • ZCE Package - Discrete
  • ZCZ Package - Discrete
• AM437 - Discrete only

Device	DRAM		Flash
	Discrete	PoP	Discrete	PoP
AM17x	ZKB		ZKB
AM18x	ZCE		ZCE
OMAP35x	CUS/CBB	CBB/CBC	CUS/CBB/CBC	CBB/CBC
AM35x	ZCN/ZER		ZCN/ZER
AM/DM37x	CUS	CBP/CBC	CUS/CBP/CBC	CBP/CBC
AM335x	ZCE		ZCE
	ZCZ		ZCZ
AM437x	ZDN		ZDN

 

DRAM Selection

To choose the proper DRAM for your application you need to first determine what is supported by your processor.  You will need to consider the following:

• What type of DRAM does the processor support
• What is the Bus Width of the interface
• What is the Clock Speed
• Does the Processor support the density required for your application

 

Below is a list of supported DRAM types by device:

Device	Memory Type	Bus Width	Max Clock Speed	CAS Latencies	Max Addressable space per CS	Number of CS	Total Addressable Space *
AM17x	SDR	16/32b	133MHz		2Gb	1	2Gb
AM18x	LPDDR1	16b	150MHz	2, 3	2Gb	1	2Gb
	DDR2		156MHz	2, 3, 4, 5	4Gb		4Gb
OMAP35x	LPDDR1	16/32b	166MHz	1, 2, 3, 4, 5	4Gb	2	8Gb
AM35x	LPDDR1	16/32b	166MHz	2, 3	4Gb	2	8Gb
	DDR2			2, 3, 4, 5
AM/DM37x	LPDDR1	16/32b	200MHz	1, 2, 3, 4, 5	4Gb	2	8Gb
AM335x	LPDDR1	16b	200MHz	2, 3, 4	8Gb	1	8Gb
	DDR2		266MHz	3, 4, 5, 6, 7
	DDR3/L		400MHz	5, 6, 7, 8, 9, 10, 11
AM437x	LPDDR2	32b	266MHz	3, 4, 5, 6, 7, 8	8Gb	2	16Gb
	DDR3/L		400MHz	5, 6, 7, 8, 9, 10, 11

NOTE:*  the maximum load allowed for the DDR interface is 2 Dies.  Currently, the largest monolithic LPDDR1 device is 2Gb so for the LPDDR1 controllers you may be limited on the density based on this.

 

NAND Flash Selection

To choose a proper NAND Flash device for your application you need to determine what is supported by your processor.

• Does the processor support Asynchronous, Synchronous, or both
• What is the bus width of the interface
• What is the clock speed
• What density does your system require
• How many bits of ECC does the Flash require
• What is the page size of the memory

Please see the links below to help designing NAND devices with TI Processors:

NAND Compatibility

Raw NAND ECC

Managed NAND

PoP Memories

The OMAP35x and AM37x devices have some packages that must use PoP memories.  When designing with PoP memories please ensure that you have secured memories for the lifetime of your system. 

• What is the lifetime of the system and will the memory be available for the entire life
• Should the PoP memory be an MCP with both DRAM and Flash
  • Is the MCP with the needed density for both DRAM and Flash available
• Same considerations as above for NAND and DRAM

Memory Vendors

There are many different memory vendors.  Below is a list of some of the vendors that TI communicates with regularly.  While we will continue to update this periodically please keep in mind that the memory industry moves very quickly and it is always best to contact the manufacturer or distributor to determine the proper part numbers and availability.  Please click the links below to see the parts that are currently available. 

Vendor	DRAM	Flash	PoP	Contact
Micron	Yes	Yes	Yes - MCP available	Distributors and Sales Reps Product Longevity Program
Microsemi	Yes	Yes	Yes - MCP available	Product info and Sales contact
Hynix	Yes	Yes	Yes - MCP available	Smith and Associates - PH: 1 800-468-7866 Email: houston@nfsmith.com
Samsung	Yes	Yes	Yes - MCP available	Distributors
Elpida	Yes	No	Yes - DRAM only	Sales offices
Toshiba	No	Yes	Yes - They buy from other DRAM vendor	Sales Contacts
ISSI	Yes	No	No	Distributors
Spansion	No	Yes	No	Sales Reps and Distributors