CC256X MSP:EXP430F5438

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Introduction

The MSP430+CC256x Bluetooth Platform provides a pre-integrated, pre-validated system solution to add Bluetooth to new and existing MSP430 applications. The platform uses a CC256x-based module from Panasonic: CC256xQFNEM. The CC256xQFNEM evaluation module kit (EMK) comes with a CC256xQFNEM modules that plug into a pair of MSP430F5438 Experimenter Boards (sold separately) which can be used for development. The solution uses TI’s Bluetooth stack which run on the MSP430 microcontroller and interface with the CC256xQFNEM module via UART.

• The MSP430BT5438+CC256x Software Development Kit (SDK) includes the Bluetooth stack, sample applications, and can be licensed from TI for commercial use with the MSP430F5438 device which must be used in the manufacturer's end product.

The table below depicts briefly the hardware and software partition of this platform.

Device	Hardware	Software
BLUETOOTH	CC256x	BT Firmware MAC/PHY
HOST
	MSP430F5438	TI’s Bluetooth Stack UART

Kit Content

The following kits are required to develop using the MSP430 Bluetooth platform and run the demos:

PAN1323EMK

• 1 CC256xQFNEM (Easy to Use) boards (included)
• 4 Jumpers for MSP430F5438 Experimenter board (included)
• Order Link

MSP430F5438 Experimenter Board

• 2 MSP430F5438 Experimenter Board* (1 included)
• Order Link

MSP430 USB Debugging Interface

• MSP430 USB Debugging Interface (included)
• Order Link

Note that the MSP430F5438 Experimenter board can be replaced with the EZ430-RF256x.

Key Features

• Based on TI's MSP430 microcontroller and CC256x Bluetooth solution
• Bluetooth 4.0 + Enhanced Data Rate (EDR) compliant
• Serial Port Profile (SPP) for MSP430 applications needing a wireless serial link
• Sample applications demonstrate the use of APIs for application development
• No NRE, royalty-free production license from TI for Bluetooth stack, SPP profile and sample applications
• Extensible via 3rd parties for additional Bluetooth profiles
• Bluetooth Low Energy upgradeable
• Panasonic PAN1323 Bluetooth module is FCC, IC, CE certified.

HW Architecture

The MSP430+CC256x Platform consists of two complete setups to evaluate Bluetooth connectivity. Each setup is composed of the existing MSP430F5438 Experimenter Board and a PAN1323ETU board. The PAN1323EMK provides the two required PAN1323ETU boards. The two required MSP430F5438 Experimenter Boards can be bought separately or you can use your own if already have them. Each setup provides a complete Bluetooth solution by having the MSP430F5438 Experimenter Board running the TI's Bluetooth Stack and the PAN1323ETU board wiht the PAN1323 Bluetooth module. The MSP430F5438 Experimenter Board and the PAN1323ETU board are interconnected as shown below.

MSP430F5438 Experimenter Board

The MSP430F5438 Experimenter board is a development platform for the latest generation MSP430 MCUs. In this MSP430BT5438+CC256x Platform, the MSP430F5438 Experimenter Board acts as the host which runs the TI's Bluetooth stack and leverages the RF1 and RF2 connectors to communicate to the PAN1323ETU board via UART.

The RF3 connector is used to route some missing MSP430 pins to the RF1 and RF2 connectors.

Two power modes are supported: USB and Battery, and the selection is made through the Power Switch.

Power Selection

The MSP430BT5438+CC256x Platform can be powered by USB or Battery. The supplied mode is selected with the Power Switch. 

The three Power Jumpers - JP1, JP2 and JP3 - must be connected to enable power to the MSP430 chip, the MSP430F5438 Experimenter Board and the PAN1323ETU board, respectively.

RF1 and RF2 Connectors

The RF1 and RF2 connectors enable access to the MSP430 pins, power and ground lines in the MSP430F5438 Experimenter Board. Some of the MSP430 pins are routed to these connectors through the RF3 connector - refer to section below. The PAN1323ETU plugs onto to these connectors.

RF3 Connector

The RF3 connector is used to route some missing pins from the MSP430 chip to the RF1 and RF2 connectors to support the PAN1323ETU board. These RF1 and RF2 connectors do not provide direct access to all the required MSP430 pins to support the PAN1315AETU board. The RF3 Adapter board interconnects the pins as shown below

• Pin 3 - Pin 6
• Pin 5 - Pin 8
• Pin 7 - Pin 10
• Pin 11 - Pin 14

RF3
Pin	PAN1323EMK Pin	Brief Description
1	GND	Ground
2	RF_PWR	PAN1323EMK Power
4	BT_HCI_CTS_3V3	Bluetooth CTS 3.3V
6	SLOW_CLK_3V3	Bluetooth Slow Clock 32kHz
8	BT_HCI_RX_3V3	Bluetooth UART RX 3.3V  MSP430 TX, PAN1323 RX
10	BT_HCI_TX_3V3	Bluetooth UART TX 3.3V  MSP430 RX, PAN1323 TX
11	BT_HCI_RTS_3V3	Bluetooth RTS 3.3V

PAN1323ETU Board

The PAN1323ETU board contains the PAN1323 module which leverages TI's CC256x Bluetooth solution. This board sits on top of the RF1 and RF2 connectors of the MSP430F5438 Experimenter Board to enable a complete Bluetooth solution - Bluetooth HCI Controller plus Bluetooth Stack. The PAN1323ETU board contains the following components to support the PAN1323 Module:

• 1.8V LDO: Supplies 1.8V to the PAN1323 module for its IOs.
• Level Shifters: Converts the MSP430 chip - PAN1323 module IO connections from 3.3V to 1.8V and vice versa. The IOs are the 4 UART lines, the BT nSHUTDOWN line and the SLOW CLOCK line. 
• RF Switch Connector: Provides an easy connection for RF testing.
• Power Jumpers: Enables/disables power to the PAN1323 module. Current consumption of the module can be measured from here.

PAN1323 Module

The PAN1323 Module leverages TI's CC256x Bluetooth solution.
It is a fully qualified Bluetooth v4.0 + EDR HCI-based module and it has been pre-tested and certified for FCC, IC, CE.

PAN1323 module contains the following main components:

• CC256x Bluetooth Controller
• 26MHz XTAL - fast clock
• BandPass Filter for reducing spurious emissions

For more information, please visit the PAN1323 Module Web Site

SW Architecture

CC256x TI’s Bluetooth Stack

• The MSP430F5430+CC256x Software Development Kit (SDK) provides access to the Bluetooth TI’s Bluetooth Stack APIs.
• Users can develop their own application and interact with the Bluetooth TI’s Bluetooth Stack APIs to enable Bluetooth connectivity on their end products.
• Please refer to the [MSP430BT5438+CC256x Developer's Guide] for more information.
• Demo application source code including the TI’s Bluetooth stack can be downloaded from the following link:
  CC2564_BT_BLE_SP_BTS.zip
• For more information on Demos refer to the Demo Applications section.

Required Tools

• IAR Embedded Workbench for TI MSP430

The IAR Embedded Workbench for TI MSP430 is a set of development tools for building and debugging embedded applications for MSP430 microcontrollers using assembler, C and C++. It is provided by IAR Systems.
The MSP430+CC256x SDK Demo and Sample Applications can be used with the Evaluation Edition.

For more information please go to the IAR Web Site or visit the IAR Embedded Workbench for TI MSP430 Wiki Site

• FET-Pro430 Lite Version

The FET-Pro430 programming software can be used to program the flash memory of MSP430 devices via the MSP-FET430UIF and the eZ430 dongle.

For more information please visit the FET-Pro430 Flash Programming Software Web Site

• MSP-EXP430F5438 USB Drivers

The MSP430F5438 Experimenter Board USB drivers are located in the SLAC227 package under the Update_EEPROM folder.

For more information please refer to the MSP-EXP430F5438 Web Site.

• MSP-FET430UIF Emulation Interface - Programming and Debugging Interface 

The MSP-FET430UIF is a powerful flash emulation tool to quickly begin application development on the MSP430 MCU. It includes a USB debugging interface used to program and debug the MSP430 in-system through the JTAG interface.

For more details visit the MSP430 USB Debugging Interface Web Site.

Demo Applications

TI’s Bluetooth Stack

For more detail information on each of the demos visit The TI’s Bluetooth Basic Demo APPS Wiki.

SPP Demo

• This application shows how to utilize the SPP module and also how handle the different callback events. The application can be used to interface with a remote SPP Client or Server.

SPP + SPPLE Demo

• This application shows how to utilize Low Energy (LE) and the GATT profile. This sample emulates using SPP over LE using the GATT Profile. This sample acts as a LE Master and LE Slave.
• This application also shows how to utilize the SPP module and how to handle the different SPP callback events. This will act as either a SPP Server or SPP Client and exposes the same command set for SPP as the SPPDemo.

ANP Demo

• This application shows how to utilize Low Energy (LE) and the GATT profile. This sample implements the Alert Notification Profile (ANP) using the GATT profile. This sample acts as a LE Master and LE Slave.

HRP Demo

• This application shows how to utilize Low Energy (LE) and the GATT profile. This sample implements the Heart Rate Monitoring Profile (HRP) using the GATT profile. This sample acts as a LE Master and LE Slave.

HTP Demo

• This application shows how to utilize Low Energy (LE) and the GATT profile. This sample implements the Health Thermometer Profile (HTP) using the GATT profile. This sample acts as a LE Master and LE Slave.

PASP Demo

• This application shows how to utilize Low Energy (LE) and the GATT profile. This sample implements the Phone Alert Status Profile (PASP) using the GATT profile. This sample acts as a LE Master and LE Slave.

Support

FAQs

Please review the FAQ Wiki which has about 60 questions and answers about the platform.

E2E Forum

In addition, you can ask engineers questions on the standard MSP430™16-bit Ultra-Low Power MCUs Forum.